The use of plasma etchers in semiconductor careers! The quality of integrated circuit lead bonding has a decisive influence on the reliability of microelectronic devices, and the bonding area must be free of pollutants and have outstanding bonding characteristics. The presence of pollutants such as oxides and organic residues can seriously weaken the pull value of lead bonding. Traditional wet cleaning can not completely or can not remove the bonding area of pollutants, and the plasma etching machine can be useful to remove the bonding area surface pollution, activate its surface, can significantly advance the bonding force of the lead, greatly improve the reliability of the packaging equipment.

The bonding between the chip and the packaging substrate is generally two materials with different properties. The surface of the material is generally hydrophobic and lazy. The surface bonding function is poor, and the interface is simply cracked during the bonding process, which brings great danger to the sealed chip. The plasma treatment of the surface of the chip and the packaging substrate can be useful to improve its surface activity, greatly improve the fluidity of the epoxy resin on its surface, advance the bond permeability of the chip and the packaging substrate, and reduce the delamination of the chip and the substrate.

In the inverted chip packaging, the chip and the packaging plate plasma treatment can not only obtain the ultra-purified welding surface, but also greatly advance the activity of the welding surface, which can be useful to prevent virtual welding, reduce emptiness, advance welding reliability, advance packing edge height and inclusiveness, advance packaging mechanical strength, reduce the thermal expansion coefficient of different materials, Forward product reliability and longevity.

By bombarding the surface of the object with plasma, the intention of etching, activating and cleaning the surface of the object can be achieved. The viscosity and welding strength of these surfaces can be significantly enhanced. Plasma surface treatment systems are currently being used to clean and etch LCD, LED, IC, PCB, SMT, BGA, wire structure and flat panel displays. The IC of the plasma etcher can significantly advance welding strength, reducing the possibility of circuit failure. Residual photoresistance agents, resins, solution residues and other organic contaminants are exposed to the plasma area and can be eradicated in a short time. PCB manufacturers use plasma etching systems to decontaminate and etch insulation in boreholes. For many products, whether they are used in industry. The reliability of electronics, aviation, health and other occupations depends on the bond strength between the two surfaces. Whether the surface is metal, ceramic, polymer, plastic or composite, plasma has the potential to advance adhesion, after all the quality of the product. The ability of plasma etchers to alter any surface is safe, environmentally friendly and economical. It is a viable solution to the challenges faced by many professions.