With the continuous development of microelectronics technology, the frequency of processor chips is getting higher and higher, the function is getting stronger and stronger, the number of pins is increasing, the size of the chip characteristics is getting smaller and smaller, the size of the package is also changing, in order to improve the function of the product, the online plasma cleaning machine is slowly spread, then what is the composition of this device, and how does it work on the production line?

On-line plasma cleaning machine has the advantages of low cost, easy to use, low protection cost and environmental protection. The base surface treatment is mainly for the IC packaging production process, take out the lead bonding, flip chip packaging production process, take out the flexible plate in the material box and plasma clean it, remove the surface pollution of the data, no human interference.

Already the efficiency of this equipment is so high, let's take a look at the online plasma cleaning equipment process:

(A) The four boxes filled with flexible plates are placed on the loading and unloading channels, and the pusher device pushes the front sheets out to the loading and unloading transmission system.

(B) The loading and unloading transmission system transmits the material to the high platform of the material communication channel through the press wheel and belt transmission, and locates it through the feeding system.

(C) The channel of the connected sheet is communicated to the lower part of the plasma echo chamber, and the vacuum chamber is closed by the improved system for plasma cleaning. When the high platform is transmitted to the cleaning position, the low platform is transmitted to the receiving orientation for the second layer of receiving material. After the high platform is cleaned, it communicates with the low platform, plasma cleaning is carried out on the low platform, and the high platform is returned to the receiving orientation.

(D) The sheet on the material exchange channel is transferred from the material transfer system to the material transfer system, and returned to the material box through the press wheel and belt to complete a process. The pusher organization pushes the next layer of sheet to proceed to the next process.

With the continuous development of microelectronics technology, the frequency of processor chips is getting higher and higher, the function is getting stronger and stronger, the number of pins is increasing, the size of the chip characteristics is getting smaller and smaller, the size of the package is also changing, in order to improve the function of the product, the online plasma cleaning machine is slowly spread, then what is the composition of this device, and how does it work on the production line?

On-line plasma cleaning machine has the advantages of low cost, easy to use, low protection cost and environmental protection. The base surface treatment is mainly for the IC packaging production process, take out the lead bonding, flip chip packaging production process, take out the flexible plate in the material box and plasma clean it, remove the surface pollution of the data, no human interference.

Already the efficiency of this equipment is so high, let's take a look at the online plasma cleaning equipment process:

(A) The four boxes filled with flexible plates are placed on the loading and unloading channels, and the pusher device pushes the front sheets out to the loading and unloading transmission system.

(B) The loading and unloading transmission system transmits the material to the high platform of the material communication channel through the press wheel and belt transmission, and locates it through the feeding system.

(C) The channel of the connected sheet is communicated to the lower part of the plasma echo chamber, and the vacuum chamber is closed by the improved system for plasma cleaning. When the high platform is transmitted to the cleaning position, the low platform is transmitted to the receiving orientation for the second layer of receiving material. After the high platform is cleaned, it communicates with the low platform, plasma cleaning is carried out on the low platform, and the high platform is returned to the receiving orientation.

(D) The sheet on the material exchange channel is transferred from the material transfer system to the material transfer system, and returned to the material box through the press wheel and belt to complete a process. The pusher organization pushes the next layer of sheet to proceed to the next process.